Release FlashMaster 2.5.0

Author: PeratX

.github/workflows/release.yml

@@ -19,18 +19,16 @@ jobs:
 
     steps:
       - name: Checkout
-        uses: actions/checkout@v4
+        uses: actions/checkout@v7
         with:
           fetch-depth: 0
           submodules: recursive
 
       - name: Setup pnpm
-        uses: pnpm/action-setup@v4
-        with:
-          version: 10.29.3
+        uses: pnpm/action-setup@v6
 
       - name: Setup Node.js
-        uses: actions/setup-node@v4
+        uses: actions/setup-node@v6
         with:
           node-version: 24
           cache: pnpm

CHANGELOG-zh.txt

@@ -1,42 +1,27 @@
 FlashMaster by PeratX <peratx@itxtech.org>
 版权所有 (c) 2019-2026 iTX Technologies
 ===================================
-版本 2.5.0-dev（开发快照日期：2026-07-06）
+版本 2.5.0（发布日期：2026-07-06）
 本版本特别致谢 HFB 提供的资料支持，帮助完善 Raw NAND 解码规则。
 
 FlashMaster 更新：
-- 更新前端与运行时依赖到最新兼容版本，保持 Vue 3 + Vuetify 工具界面与当前依赖生态同步。
-- 打磨依赖刷新后的使用体验：优化侧边栏文字颜色、菜单与联想候选显示、控制器分组选择、snackbar 位置、按钮对比度，以及关联卡片的焦点和边框表现。
 - 优化 PWA 更新与缓存策略：入口 HTML、公开 SPA 路由、Service Worker 文件和 manifest 打开时重新验证，hash 静态资源继续长期缓存；已安装用户在新版 Service Worker 接管后自动刷新一次进入新版本。
 - 优化内嵌 fdnext 响应速度：常规 Web 与 full/nano 单文件构建会在合适时机预热解析器，并通过 module worker 异步执行内嵌解析/搜索；常规 Web 构建继续保留主线程降级路径，HTTP-only 构建保持可用。
 - 优化 PN 与 Flash ID 联想输入：继续保留防抖，新查询会立即清空旧候选，并避免内嵌搜索阻塞 UI 渲染。
+- 打磨依赖刷新后的高密度工作台体验，包括侧边栏文字颜色、菜单与联想候选显示、控制器分组选择、snackbar 位置、按钮对比度，以及关联卡片的焦点和边框表现。
 - 优化 Market Pulse 图表交互：桌面端点击 ticker 与横向拖动现在使用更清晰的手势阈值，点击可可靠展开靠近点击位置的图表，拖动或横向滚动 ticker 时关闭图表，并在拖动被动关闭图表后恢复 ticker 自动滚动。
 - 为 fdnext 新增的 `3d_xpoint` 芯片类型补充 FlashMaster 显示标签，让结果 badge 与能力页显示为 `3D XPoint`。
 
 fdnext v3.1.0 支持面摘要：
-- 内嵌解析器集成 fdnext v3.1.0（6a852c1）。
-- 扩展 SK hynix raw NAND 解码规则，补充更广的 H25/H27/HY27 raw NAND token 覆盖，新增 H2E/H2N 细节并更新规则路由。
-- 暴露 Micron DRAM stack series 输出，覆盖 TwinDie、QuadDie 与 DDR4 3DS 封装。
-- 扩展 Micron DDR3/DDR3L/DDR4/DDR5 package 覆盖，包括 DDR4 JE/KH 和更多按封装区分的 die/CS 映射。
-- 修复 Micron `D9XLQ` TwinDie DDR3L 料号解码。
-- 扩展 Micron SSD DecodePack 覆盖，包括更广的 Micron SSD 料号解码。
-- 新增 Micron DDR3 DRAM 解码覆盖，并扩展 SpecTek DRAM package / product code token 处理。
-- 优化 DRAM die count geometry、Samsung raw NAND notes，以及基于 DecodePack profiles 的 FDB NAND relations 裁剪。
-- 新增 fd-server Workers 部署支持，并修复上游 Workers deploy script 参数转发。
-- 新增 Intel 与 Micron 3D XPoint 料号解码，包含新的 `3d_xpoint` 结果类型与字段分组。
-- 新增 Micron EDY DDR4 料号解码，并扩展 Micron DDR4/DDR5 package、speed 与覆盖范围处理。
-- 优化 SpecTek DDR5/DDR3 解码，并降低 fdnext decode warmup 开销。
-- 新增 fdnext decodepack array table 支持，并优化 MDB crawl header routing。
-- 优化 Samsung raw NAND 后缀解码、MCP 公开字段、DecodePack package 输出归一化，以及基于 DecodePack metadata 的 FDB 查询匹配。
-- 新增 fdnext 上游 FlashDetector 兼容 `fd-server` 包，便于 legacy API 兼容部署场景。
-- 优化 raw NAND 料号覆盖，包括 Samsung stack 与 die-profile 解码、KIOXIA profile、SanDisk ECB/WCS raw NAND，以及 SpecTek `PF285` / `PF580` 系列。
-- 修复 Intel QLC 3D4 profile 归一，让 Intel raw NAND 料号结果匹配到正确 profile。
-- 新增无连字符料号解码，让归一化后的 PN 输入可在缺少分隔符时继续解析。
-- 修复 Samsung raw NAND token/package 输出与 Micron HSC channel count 输出。
-- 优化 fdnext PN 搜索快速路径，并同步搜索结果契约：`/parts/search` 与 `/identifiers/search` 保持摘要型输出，控制器投影继续由 decode 接口提供。
-- 新增并优化 Micron raw NAND DecodePack 覆盖，包括 `MT29FB` HSC raw NAND、HSC NAND 技术备注、冒号修订归一，以及 current/legacy raw NAND 结构化 token 解码。
-- 更新 SK hynix H25 raw NAND current 与 legacy 料号族解码，扩展 HYV4-HYV9/HYV9Q profile 匹配、die density、die count、CE/R/B/channel 与电压输出。
-- 扩展已确认 SK hynix H25 HYV9/HYV9Q package tail 处理，让 package 表命中的条目可输出封装尺寸、产品级别和速率信息；未知 tail 继续按稳定 token 字段降级。
+- 内嵌解析器集成 fdnext v3.1.0（d7d9655）。
+- 扩展 SK hynix、Samsung、Micron、KIOXIA、SanDisk、SpecTek、Intel 等 Raw NAND 料号解码，覆盖更广的 SK hynix H25/H27/HY27 路由、H2E/H2N 细节、受控的 SK hynix 3D die-profile identifier 匹配、结构化 Micron MT29FB/HSC 处理，以及 Samsung stack/die/suffix/package、KIOXIA/SanDisk/SpecTek/Intel QLC profile 归一优化。
+- 新增 Intel 与 Micron 3D XPoint 料号解码，并引入新的 `3d_xpoint` 芯片类型。
+- 扩展 Micron DRAM 覆盖，包括 DDR3/DDR3L/DDR4/DDR5 封装、`D9XLQ` TwinDie DDR3L、EDY DDR4、JE/KH DDR4，以及 TwinDie / QuadDie / DDR4 3DS stack-series 输出。
+- 扩展 Micron SSD DecodePack 覆盖，支持更多 client 与 automotive SSD 料号结构，并优化 SpecTek DRAM product code 与 mobile DRAM package 解码。
+- 新增 DecodePack array table 支持，归一 package 输出，优化 MCP 公开字段，拆分 DRAM die-count geometry，降低 decode warmup 开销，并收紧公开输出措辞与 code-token 审计。
+- FDB 关联裁剪规则改为基于 DecodePack NAND die/profile metadata 匹配 PN 与 Flash ID 关系，让 KIOXIA/SanDisk、Micron/SpecTek、Samsung、SK hynix 周边的 Raw NAND alias 更准确。
+- 上游新增 FlashDetector 兼容 `fd-server` 包，并补充 Node.js 与 Cloudflare Workers 部署支持，便于 legacy HTTP 路由兼容场景。
+- 完整解析器与资源细节集中查看 fdnext release notes：[iTXTech/fdnext](https://github.com/iTXTech/fdnext/releases/tag/v3.1.0)
 
 ===================================
 版本 2.4.0（发布日期：2026-05-31）

CHANGELOG.txt

@@ -1,42 +1,27 @@
 FlashMaster by PeratX <peratx@itxtech.org>
 Copyright (c) 2019-2026 iTX Technologies
 ===================================
-Version 2.5.0-dev (Development snapshot date: 2026-07-06)
+Version 2.5.0 (Release date: 2026-07-06)
 Special thanks to HFB for providing reference material that helped refine the Raw NAND decoding rules in this release.
 
 FlashMaster updates:
-- Updated frontend and runtime dependencies to the latest compatible releases, keeping the Vue 3 + Vuetify tool surface current.
-- Polished the dependency-refresh UX: improved sidebar text colors, menu and suggestion rendering, controller-group selection, snackbar placement, button contrast, and relation-card focus/border behavior.
 - Improved PWA update freshness while preserving offline cache: entry HTML, public SPA routes, service-worker files, and the manifest now revalidate on open, hashed static assets stay long-cached, and installed users refresh once after a new service worker takes control.
 - Improved embedded fdnext responsiveness in web and full/nano single-file builds: the parser now warms up after the first paint where appropriate and runs embedded decode/search work asynchronously in a module worker, while regular web builds keep a main-thread fallback and HTTP-only builds remain available.
 - Improved PN and Flash ID suggestions by keeping debounce behavior, clearing stale candidates immediately for new queries, and avoiding UI-render blocking during embedded searches.
+- Polished the dense workstation UI after the dependency refresh, including sidebar text colors, menus, suggestion rendering, controller-group selection, snackbar placement, button contrast, and relation-card focus/border behavior.
 - Improved Market Pulse chart behavior: desktop ticker clicks and horizontal drags now use a cleaner gesture threshold, clicks reliably open charts near the clicked ticker, drags or horizontal scroll close open charts, and ticker auto-scroll resumes after a drag closes an open chart.
 - Added a polished FlashMaster display label for fdnext's new `3d_xpoint` chip kind in result badges and capability views.
 
 fdnext v3.1.0 support highlights:
-- Integrated fdnext v3.1.0 (6a852c1) in the embedded parser.
-- Expanded SK hynix raw NAND decoding rules with broader H25/H27/HY27 raw NAND token coverage, added H2E/H2N details, and updated rule routing.
-- Exposed Micron DRAM stack-series output for TwinDie, QuadDie, and DDR4 3DS packages.
-- Broadened Micron DDR3/DDR3L/DDR4/DDR5 package coverage, including DDR4 JE/KH and additional package-specific die/CS mappings.
-- Fixed Micron `D9XLQ` TwinDie DDR3L part-number decoding.
-- Expanded Micron SSD DecodePack coverage, including broader Micron SSD part-number decoding.
-- Added Micron DDR3 DRAM decoding coverage and expanded SpecTek DRAM package/product-code token handling.
-- Refined DRAM die-count geometry, Samsung raw NAND notes, and FDB NAND relation trimming by DecodePack profiles.
-- Added fd-server Workers deployment support and fixed Workers deploy script forwarding upstream.
-- Added Intel and Micron 3D XPoint part-number decoding, including the new `3d_xpoint` result kind and field profile.
-- Added Micron EDY DDR4 part-number decoding and broadened Micron DDR4/DDR5 package, speed, and coverage handling.
-- Optimized SpecTek DDR5/DDR3 decoding and reduced fdnext decode warmup overhead.
-- Added fdnext decodepack array-table support and improved MDB crawl header routing.
-- Refined Samsung raw NAND suffix decoding, MCP public fields, DecodePack package output normalization, and FDB lookup matching through DecodePack metadata.
-- Added fdnext's upstream FlashDetector-compatible `fd-server` package for legacy API compatibility scenarios.
-- Improved raw NAND part-number coverage for Samsung stack and die-profile decoding, KIOXIA profiles, SanDisk ECB/WCS raw NAND, and SpecTek `PF285` / `PF580` families.
-- Fixed Intel QLC 3D4 profile normalization for matching Intel raw NAND part-number results.
-- Added dashless part-number decoding so normalized PN input can resolve without separator characters.
-- Fixed Samsung raw NAND token/package output and Micron HSC channel-count output.
-- Optimized fdnext PN search fast paths and aligned search result contracts: `/parts/search` and `/identifiers/search` stay summary-focused, while controller projection remains a decode-only detail.
-- Added and refined Micron raw NAND DecodePack coverage, including `MT29FB` HSC raw NAND, HSC NAND technology notes, colon revision normalization, and structured current/legacy raw NAND token decoding.
-- Updated SK hynix H25 raw NAND decoding across current and legacy part-number families, including broader HYV4-HYV9/HYV9Q profile matching, die density, die count, CE/R/B/channel, and voltage output.
-- Expanded confirmed SK hynix H25 HYV9/HYV9Q package-tail handling so known package-table entries can surface package dimensions, product class, and speed details while unknown tails continue to degrade to stable token fields.
+- Integrated fdnext v3.1.0 (d7d9655) in the embedded parser.
+- Expanded Raw NAND PN decoding across SK hynix, Samsung, Micron, KIOXIA, SanDisk, SpecTek, and Intel, including broader SK hynix H25/H27/HY27 routing, H2E/H2N details, gated SK hynix 3D die-profile identifier matching, structured Micron MT29FB/HSC handling, improved Samsung stack/die/suffix/package decoding, and cleaner KIOXIA/SanDisk/SpecTek/Intel QLC profile normalization.
+- Added Intel and Micron 3D XPoint part-number decoding with the new `3d_xpoint` chip kind.
+- Expanded Micron DRAM coverage across DDR3/DDR3L/DDR4/DDR5 packages, `D9XLQ` TwinDie DDR3L, EDY DDR4, JE/KH DDR4 packages, and TwinDie / QuadDie / DDR4 3DS stack-series output.
+- Expanded Micron SSD DecodePack coverage for broader client and automotive SSD part-number structures, and improved SpecTek DRAM product-code and mobile DRAM package decoding.
+- Added DecodePack array-table support, normalized package outputs, refined MCP public fields, separated DRAM die-count geometry, reduced decode warmup overhead, and tightened public-output wording/code-token audits.
+- Updated FDB relation trimming to match PN and Flash ID relations against DecodePack NAND die/profile metadata, producing more accurate Raw NAND aliases around KIOXIA/SanDisk, Micron/SpecTek, Samsung, and SK hynix records.
+- Added the FlashDetector-compatible `fd-server` package upstream, including Node.js and Cloudflare Workers deployment support for legacy HTTP routes.
+- Full parser and resource details are tracked in the fdnext release notes: [iTXTech/fdnext](https://github.com/iTXTech/fdnext/releases/tag/v3.1.0)
 
 ===================================
 Version 2.4.0 (Release date: 2026-05-31)

package.json

@@ -3,7 +3,7 @@
   "version": "2.5.0",
   "private": true,
   "type": "module",
-  "packageManager": "pnpm@11.9.0",
+  "packageManager": "pnpm@11.10.0",
   "scripts": {
     "dev": "vite --host 127.0.0.1",
     "build": "vite build",