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chore: update embedded fdnext
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CHANGELOG-zh.txt

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FlashMaster by PeratX <peratx@itxtech.org>
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版权所有 (c) 2019-2026 iTX Technologies
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===================================
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版本 2.5.0-dev(开发快照日期:2026-06-30
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版本 2.5.0-dev(开发快照日期:2026-07-05
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本版本特别致谢 HFB 提供的资料支持,帮助完善 Raw NAND 解码规则。
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FlashMaster 更新:
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- 为 fdnext 新增的 `3d_xpoint` 芯片类型补充 FlashMaster 显示标签,让结果 badge 与能力页显示为 `3D XPoint`。
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fdnext v3.1.0 支持面摘要:
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- 内嵌解析器集成 fdnext v3.1.0(afa3366)。
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- 内嵌解析器集成 fdnext v3.1.0(dd9d8f1)。
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- 扩展 SK hynix raw NAND 解码规则,补充更广的 H25/H27/HY27 raw NAND token 覆盖并更新规则路由。
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- 暴露 Micron DRAM stack series 输出,覆盖 TwinDie、QuadDie 与 DDR4 3DS 封装。
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- 扩展 Micron DDR3/DDR3L/DDR4/DDR5 package 覆盖,包括 DDR4 JE/KH 和更多按封装区分的 die/CS 映射。
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- 修复 Micron `D9XLQ` TwinDie DDR3L 料号解码。

CHANGELOG.txt

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FlashMaster by PeratX <peratx@itxtech.org>
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Copyright (c) 2019-2026 iTX Technologies
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===================================
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Version 2.5.0-dev (Development snapshot date: 2026-06-30)
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Version 2.5.0-dev (Development snapshot date: 2026-07-05)
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Special thanks to HFB for providing reference material that helped refine the Raw NAND decoding rules in this release.
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FlashMaster updates:
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- Added a polished FlashMaster display label for fdnext's new `3d_xpoint` chip kind in result badges and capability views.
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fdnext v3.1.0 support highlights:
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- Integrated fdnext v3.1.0 (afa3366) in the embedded parser.
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- Integrated fdnext v3.1.0 (dd9d8f1) in the embedded parser.
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- Expanded SK hynix raw NAND decoding rules with broader H25/H27/HY27 raw NAND token coverage and updated rule routing.
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- Exposed Micron DRAM stack-series output for TwinDie, QuadDie, and DDR4 3DS packages.
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- Broadened Micron DDR3/DDR3L/DDR4/DDR5 package coverage, including DDR4 JE/KH and additional package-specific die/CS mappings.
2021
- Fixed Micron `D9XLQ` TwinDie DDR3L part-number decoding.

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